SK hynix to Construct $3.87 Billion Reminiscence Packaging Fab within the U.S. for HBM4 and Past
SK hynix this week introduced plans to construct its superior reminiscence packaging facility in West Lafayette, Indiana. The transfer will be thought of as a milestone each for the reminiscence maker and the U.S., as that is the primary superior reminiscence packaging facility within the nation and the corporate’s first important manufacturing operation in America. The power will probably be used to construct next-generation forms of high-bandwidth reminiscence (HBM) stacks when it begins operations in 2028. Additionally, SK hynix agreed to work on R&D initiatives with Purdue College.
“We’re excited to develop into the primary within the business to construct a state-of-the-art superior packaging facility for AI merchandise in the USA that can assist strengthen supply-chain resilience and develop a neighborhood semiconductor ecosystem,” stated SK hynix CEO Kwak Noh-Jung.
Considered one of The Most Superior Chip Packaging Facility Ever
The power will deal with meeting of HBM identified good stacked dies (KGSDs), which include a number of reminiscence gadgets stacked on a base die. Moreover, will probably be used to develop next-generations of HBM and can subsequently home a packaging R&D line. Nevertheless, the plant won’t make DRAM dies themselves, and can doubtless supply them from SK hynix’s fabs in South Korea.
The plant would require SK hynix to take a position $3.87 billion, which can make it one of the superior semiconductor packaging amenities on the earth. In the meantime, SK hynix held the funding settlement ceremony with representatives from Indiana State, Purdue College, and the U.S. authorities, which signifies events financially concerned within the mission, however this week’s occasion didn’t disclose whether or not SK hynix will obtain any cash from the U.S. authorities underneath the CHIPS Act or different funding initiatives.
The price of the power considerably exceeds that of packaging amenities constructed by different main gamers within the business, similar to ASE Group, Intel, and TSMC, which highlights how important of an funding that is for SK hnix. Actually, $3.87 billion increased than superior packaging CapEx budgets of Intel, TSMC and Samsung in 2023, primarily based on estimates from Yole Intelligence.
On condition that the fab comes on-line in 2028, primarily based on SK hynix’s product roadmap we would anticipate that will probably be used not less than partially to assemble HBM4 and HBM4E stacks. Notably, since HBM4 and HBM4E stacks are set to feature a 2048-bit interface, their packaging course of will probably be significantly extra complicated than the prevailing 1024-bit HBM3/HBM3E packaging and would require utilization of extra superior instruments, which is why it’s poised to be dearer than some present superior packaging amenities. Because of the extraordinarily complicated 2048-bit interface, many chip designers who’re going to make use of HBM4/HBM4E are anticipated to combine it immediately onto their processors utilizing hybrid bonding and never use silicon interposers. Sadly, it’s unclear whether or not the SK hynix facility will be capable to provide such service.
HBM is especially used for AI and HPC purposes, so it’s strategically essential to have its manufacturing within the U.S. In the meantime, precise reminiscence dies will nonetheless must be made elsewhere, at devoted DRAM fabs.
Purdue College Collaboration
Along with assist set to be supplied by state and native governmens, SK hynix selected to determine its new facility in West Lafayette, Indiana, to collaborate with Purdue College in addition to with Purdue’s Birck Nanotechnology Middle on R&D initiatives, which incorporates superior packaging and heterogeneous integration.
SK hynix intends to work in partnership with Purdue College and Ivy Tech Neighborhood School to create coaching applications and multidisciplinary diploma programs geared toward nurturing a talented workforce and establishing a constant stream of rising expertise for its superior reminiscence packaging facility and R&D operations.
“SK hynix is the worldwide pioneer and dominant market chief in reminiscence chips for AI,” Purdue College President Mung Chiang stated. “This transformational funding displays our state and college’s super power in semiconductors, {hardware} AI, and arduous tech hall. It is usually a monumental second for finishing the provision chain of digital financial system in our nation by chips superior packaging. Situated at Purdue Analysis Park, the most important facility of its form at a U.S. college will develop and succeed by innovation.”
