SK Hynix Mulls ‘Differentiated’ HBM Reminiscence Amid AI Frenzy
SK Hynix and AMD have been on the forefront of the reminiscence trade with the primary technology of excessive bandwidth reminiscence (HBM) again in 2013 – 2015, and SK Hynix remains to be main this market when it comes to share. In a bid to take care of and develop its place, SK Hynix has to adapt to the necessities of its prospects, significantly within the AI area, and to take action it is mulling over find out how to make ‘differentiated’ HBM merchandise for giant prospects.
“Creating customer-specific AI reminiscence requires a brand new strategy as the pliability and scalability of the expertise turns into vital,” mentioned Hoyoung Son, the pinnacle of Superior Bundle Improvement at SK Hynix within the standing of a vp
On the subject of efficiency, HBM reminiscence with a 1024-bit interface has been evolving pretty quick: it began with an information switch price of 1 GT/s in 2014 – 2015 and reached upwards of 9.2 GT/s – 10 GT/s with the just lately launched HBM3E reminiscence gadgets. With HBM4, the reminiscence is about to transit to a 2048-bit interface, which can guarantee regular bandwidth enchancment over HBM3E.
However there are prospects which can profit from differentiated (or semi-custom) HBM-based options, in response to the vp.
“For implementing numerous AI, the traits of AI reminiscence additionally must turn into extra diversified,” Hoyoung Son mentioned in an interview with BusinessKorea. “Our aim is to have a wide range of superior packaging applied sciences able to responding to those adjustments. We plan to supply differentiated options that may meet any buyer wants.”
With a 2048-bit interface, many (if not the overwhelming majority) of HBM4 options will seemingly be {custom} or a minimum of semi-custom primarily based on what we all know from official and unofficial details about the upcoming customary. Some prospects may wish to hold utilizing interposers (however this time they will get very costly) and others will choose to put in HBM4 modules straight on logic dies utilizing direct bonding strategies, that are additionally costly.
Making differentiated HBM choices requires refined packaging strategies, together with (however definitely not restricted to) SK Hynix’s Advanced Mass Reflow Molded Underfill (MR-RUF) expertise. Given the corporate’s huge expertise with HBM, it could nicely provide you with one thing else, particularly for differentiated choices.
“For several types of AI to be realized, the traits of AI reminiscence additionally have to be extra numerous,” the VP mentioned. “Our aim is to have a variety of superior packaging applied sciences to answer the shifting technological panorama. Trying forward, we plan to supply differentiated options to satisfy all buyer wants.”
Sources: BusinessKorea, SK Hynix
